Zen 2 is the codename for a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nanometer MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U (codename "Renoir") and Ryzen 5000U ("Lucienne") for mobile applications , as Threadripper 3000 for high-end desktop systems,[4][5] and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019,[6][7] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019.[8] An additional chipset, the Ryzen 9 3950X, was released in November 2019.[6]

AMD Zen 2
AMD Zen 2 logo.png
General information
LaunchedJuly 7, 2019; 18 months ago (July 7, 2019)[1]
Designed byAMD
Common manufacturer(s)
Cache
L1 cache64 KiB per core
L2 cache512 KiB per core
Architecture and classification
Min. feature size7 nm (TSMC)[2][3]
Physical specifications
Cores
  • Up to 64
Socket(s)
Products, models, variants
Product code name(s)
  • Matisse (desktop)
  • Rome (server)[3]
  • Castle Peak (HEDT)
  • Renoir (APU and embedded)
History
PredecessorZen+
SuccessorZen 3

At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads.[4] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup.[9] At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X.[10][11]

Zen 2 includes hardware mitigations to the Spectre security vulnerability.[12] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14 nm I/O die on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X.[13] Zen 2 delivers about 15% more instructions per clock than Zen and Zen+,[14][15] the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen respectively.

DesignEdit

Two delidded Zen 2 processors designed with the multi-chip module approach. The CPU on the left (top on mobile) (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the one on the right (bottom, used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die, which is also called a chiplet in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[13][16][17]

 
Simplified illustration of the Zen 2 microarchitecture
On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. On the right (bottom): Die shot of a Zen 2 EPYC I/O die.

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.[16] The chiplet has about 3.9 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2 and has 2.09 billion transistors.[18] The amount of L3 cache has been doubled to 32 MiB, with each CCX in the chiplet now having access to 16 MiB of L3 compared to the 8 MiB of Zen and Zen+.[19] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[20] There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[16] Both processes have similar feature sizes, so their transistor density is also similar.[21]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140 W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165 W.[22]

New featuresEdit

  • Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its own CPUID bit.[23][24]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[25]
  • Zero-latency memory mirroring optimization (undocumented).[26]

Feature tablesEdit

CPUsEdit

CPU features table

APUsEdit

APU features table

ProductsEdit

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors. [27]

AMD's second generation of Epyc processors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019.[8]

Desktop CPUsEdit

Model Release date
and price
Fab Cores
(threads)
Chiplets Core config[i] Clock rate (GHz) Cache Socket PCIe
lanes
Memory
support
TDP
Base Boost L1 L2 L3
Entry-level
Ryzen 3 3100[28] April 21, 2020
$99
TSMC
7FF
4 (8) 1 × CCD
1 × I/O
2 × 2 3.6 3.9 32 KiB inst.
32 KiB data
per core
512 KiB
per core
2 × 8 MiB
per CCX
AM4 24 (16+4+4) DDR4-3200
dual-channel
65 W
Ryzen 3 3300X[29] April 21, 2020
$120
1 × 4 3.8 4.3 16 MiB
Mainstream
Ryzen 5 3500 November 15, 2019
OEM (West)
Japan ¥16000[30]
TSMC
7FF
6 (6) 1 × CCD
1 × I/O
2 × 3 3.6 4.1 32 KiB inst.
32 KiB data
per core
512 KiB
per core
2 × 8 MiB
per CCX
AM4 24 (16+4+4) DDR4-3200
dual-channel
65 W
Ryzen 5 3500X[31] October 8, 2019
China ¥1099
2 × 16 MiB
per CCX
Ryzen 5 3600[32] July 7, 2019
US $199
6 (12) 3.6 4.2
Ryzen 5 Pro 3600[33] September 30, 2019
OEM
Ryzen 5 3600X[34] July 7, 2019
US $249
3.8 4.4 95 W
Ryzen 5 3600XT[35] July 7, 2020
US $249
4.5
Performance
Ryzen 7 Pro 3700[36] September 30, 2019
OEM
TSMC
7FF
8 (16) 1 × CCD
1 × I/O
2 × 4 3.6 4.4 32 KiB inst.
32 KiB data
per core
512 KiB
per core
2 × 16 MiB
per CCX
AM4 24 (16+4+4) DDR4-3200
dual-channel
65 W[ii]
Ryzen 7 3700X[38] July 7, 2019
US $329
Ryzen 7 3800X[39] July 7, 2019
US $399
3.9 4.5 105 W
Ryzen 7 3800XT[40] July 7, 2020
US $399
4.7
Enthusiast
Ryzen 9 3900[41] October 8, 2019
OEM
TSMC
7FF
12 (24) 2 × CCD
1 × I/O
4 × 3 3.1 4.3 32 KiB inst.
32 KiB data
per core
512 KiB
per core
4 × 16 MiB
per CCX
AM4 24 (16+4+4) DDR4-3200
dual-channel
65 W
Ryzen 9 Pro 3900[42] September 30, 2019
OEM
Ryzen 9 3900X[43] July 7, 2019
US $499
3.8 4.6 105 W[iii]
Ryzen 9 3900XT[44] July 7, 2020
US $499
4.7
Ryzen 9 3950X[45] November 25, 2019
US $749
16 (32) 4 × 4 3.5
Workstation and High-End Desktop
Ryzen Threadripper 3960X[46] November 25, 2019
US $1399
TSMC
7FF
24 (48) 4 × CCD
1 × I/O
8 × 3 3.8 4.5 32 KiB inst.
32 KiB data
per core
512 KiB
per core
8 × 16 MiB
per CCX
sTRX4 64 (60+4) DDR4-3200
quad-channel
280 W[iv]
Ryzen Threadripper 3970X[48] November 25, 2019
US $1999
32 (64) 8 × 4 3.7 4.5
Ryzen Threadripper 3990X[49] February 7, 2020
US $3990
64 (128) 8 × CCD
1 × I/O
16 × 4 2.9 4.3 16 × 16 MiB
per CCX
Workstation
Ryzen Threadripper Pro 3945WX[50] July 14, 2020
OEM
TSMC
7FF
12 (24) 2 × CCD
1 × I/O
4 × 3 4.0 4.3 32 KiB inst.
32 KiB data
per core
512 KiB
per core
4 × 16 MiB
per CCX
sWRX8 128 DDR4-3200
octa-channel
280 W
Ryzen Threadripper Pro 3955WX[51] July 14, 2020
OEM
16 (32) 4 × 4 3.9
Ryzen Threadripper Pro 3975WX[52] July 14, 2020
OEM
32 (64) 4 × CCD
1 × I/O
8 × 4 3.5 4.2 8 × 16 MiB
per CCX
Ryzen Threadripper Pro 3995WX[53] July 14, 2020
OEM
64 (128) 8 × CCD
1 × I/O
16 × 4 2.7 4.2 16 × 16 MiB
per CCX
  1. ^ Active Core Complexes (CCXs) × active cores per CCX.
  2. ^ Ryzen 7 3700X may consume over 90 W under load.[37]
  3. ^ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[37]
  4. ^ Ryzen Threadripper 3990X may consume over 490 W under load.[47]

Desktop APUsEdit

Model Release date
and price
Fab. CPU GPU Socket PCIe
lanes
Memory
support
TDP
Cores
(threads)
Core Config[i] Clock rate (GHz) Cache Model Config.[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 4300GE [54] 2H 2020 [55] TSMC
7FF
4 (8) 1 × 4 3.5 4.0 32 KiB inst.
32 KiB data
per core
512 KiB
per core
4 MiB Vega 6 384:24:8
6 CU
1700 MHz 1305.6 AM4 24 (16+4+4) DDR4-3200
dual-channel
35 W
Ryzen 3 Pro 4350GE[54]
Ryzen 3 4300G[54] 3.8 4.0 65 W
Ryzen 3 Pro 4350G[54]
Ryzen 5 4600GE[54] 6 (12) 2 × 3 3.3 4.2 8 MiB
4 MiB per CCX
Vega 7 448:28:8
7 CU
1900 MHz 1702.4 35 W
Ryzen 5 Pro 4650GE[54]
Ryzen 5 4600G[54] 3.7 4.2 65 W
Ryzen 5 Pro 4650G[54]
Ryzen 7 4700GE[54] 8 (16) 2 × 4 3.1 4.3 Vega 8 512:32:8
8 CU
2000 MHz 2048 35 W
Ryzen 7 Pro 4750GE[54]
Ryzen 7 4700G[54] 3.6 4.4 2100 MHz 2150.4 65 W
Ryzen 7 Pro 4750G[54]
  1. ^ Active core complexes (CCXs) × active cores per CCX.
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mobile processorsEdit

Renoir (4000 series)Edit

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory support TDP
Cores
(threads)
Core config[i] Clock rate (GHz) Cache Model,
config[ii]
Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 4300U[56] March 16, 2020 TSMC
7FF
4 (4) 1 × 4 2.7 3.7 32 KiB inst.
32 KiB data
per core
512 KiB
per core
4 MiB AMD Radeon Graphics, 320:20:8
5 CU
1400 MHz 896 FP6 16 (8+4+4) DDR4-3200
LPDDR4-4266
dual-channel
10–25 W
Ryzen 3 PRO 4450U[57] May 7, 2020 4 (8) 2.5
Ryzen 5 4500U[58] March 16, 2020 6 (6) 2 × 3 2.3 4.0 8 MiB
4 MiB per CCX
AMD Radeon Graphics,
384:24:8
6 CU
1500 MHz 1152
Ryzen 5 4600U[59] 6 (12) 2.1
Ryzen 5 PRO 4650U[60] May 7, 2020
Ryzen 5 4600HS[61] March 16, 2020 3.0 35 W
Ryzen 5 4600H[62] 35–54 W
Ryzen 7 4700U[63] 8 (8) 2 × 4 2.0 4.1 AMD Radeon Graphics,
448:28:8
7 CU
1600 MHz 1433.6 10–25 W
Ryzen 7 PRO 4750U[64] May 7, 2020 8 (16) 1.7
Ryzen 7 4800U[65] March 16, 2020 1.8 4.2 AMD Radeon Graphics,
512:32:8
8 CU
1750 MHz 1792
Ryzen 7 4800HS[66] 2.9 AMD Radeon Graphics,
448:28:8
7 CU
1600 MHz 1433.6 35 W
Ryzen 7 4800H[67] 35–54 W
Ryzen 9 4900HS[68] 3 4.3 AMD Radeon Graphics,
512:32:8
8 CU
1750 MHz 1792 35 W
Ryzen 9 4900H[69] 3.3 4.4 35–54 W
  1. ^ Active Core Complexes (CCX) × active cores per CCX.
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


Lucienne (5000 series)Edit

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory support TDP
Cores
(threads)
Core config[i] Clock rate (GHz) Cache Model,
config[ii]
Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 5300U[70] January 12, 2021 TSMC
7FF
4 (8) 1 × 4 2.6 3.8 32 KiB inst.
32 KiB data
per core
512 KiB
per core
4 MiB AMD Radeon Graphics
6 CU
1500 MHz - FP6 16 (8+4+4) DDR4-3200
LPDDR4-4266
dual-channel
10–25 W
Ryzen 5 5500U[71] 6 (12) 2 × 3 2.1 4.0 8 MiB
4 MiB per CCX
AMD Radeon Graphics
7 CU
1800 MHz
Ryzen 7 5700U[72] 8 (16) 2 × 4 1.8 4.3 8 MiB
4 MiB per CCX
AMD Radeon Graphics
8 CU
1900 MHz
  1. ^ Active Core Complexes (CCX) × active cores per CCX.
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


Server processorsEdit

Common features of these CPUs:

  • Codenamed "Rome"
  • The number of PCI-E lanes: 128
  • Release date: August 7, 2019 except EPYC 7H12 which was released on September 18, 2019
  • Memory support: eight-channel DDR4-3200
Model Release date
and price
Fab Chiplets Cores
(threads)
Core config[i] Clock rate (GHz) Cache Socket &
configuration
TDP
Base Boost L1 L2 L3
All-core Max
EPYC 7232P US $450 7 nm 2 × CCD
1 × I/O
8 (16) 4 × 2 3.1 3.2 32 KiB inst.
32 KiB data
per core
512 KiB
per core
32 MiB
8 MiB per CCX
SP3
1P
120 W
EPYC 7302P US $825 4 × CCD
1 × I/O
16 (32) 8 × 2 3 3.3 128 MiB
16 MiB per CCX
155 W
EPYC 7402P US $1250 24 (48) 8 × 3 2.8 3.35 180 W
EPYC 7502P US $2300 32 (64) 8 × 4 2.5 3.35
EPYC 7702P US $4425 8 × CCD
1 × I/O
64 (128) 16 × 4 2 3.35 256 MiB
16 MiB per CCX
200 W
EPYC 7252 US $475 2 × CCD
1 × I/O
8 (16) 4 × 2 3.1 3.2 64 MiB
16 MiB per CCX
SP3
2P
120 W
EPYC 7262 US $575 4 × CCD
1 × I/O
8 × 1 3.2 3.4 128 MiB
16 MiB per CCX
155 W
EPYC 7272 US $625 2 × CCD
1 × I/O
12 (24) 4 × 3 2.9 3.2 64 MiB
16 MiB per CCX
120 W
EPYC 7282 US $650 16 (32) 4 × 4 2.8 3.2
EPYC 7302 US $978 4 × CCD
1 × I/O
8 × 2 3 3.3 128 MiB
16 MiB per CCX
155 W
EPYC 7352 US $1350 24 (48) 8 × 3 2.3 3.2
EPYC 7402 US $1783 8 × 3 2.8 3.35 180 W
EPYC 7452 US $2025 32 (64) 8 × 4 2.35 3.35 155 W
EPYC 7502 US $2600 8 × 4 2.5 3.35 180 W
EPYC 7532 US $3350 8 × CCD
1 × I/O
16 × 2 2.4 3.3 256 MiB
16 MiB per CCX
200 W
EPYC 7542 US $3400 4 × CCD
1 × I/O
8 × 4 2.9 3.4 128 MiB
16 MiB per CCX
225 W
EPYC 7552 US $4025 6 × CCD
1 × I/O
48 (96) 12 × 4 2.2 3.3 192 MiB
16 MiB per CCX
200 W
EPYC 7642 US $4775 8 × CCD
1 × I/O
16 × 3 2.3 3.3 256 MiB
16 MiB per CCX
225 W
EPYC 7662 US $6150 64 (128) 16 × 4 2 3.3 225 W
EPYC 7702 US $6450 2 3.35 200 W
EPYC 7742 US $6950 2.25 3.4 225 W
EPYC 7H12 2.6 3.3 280 W
EPYC 7F32 US $2100 4 × CCD
1 × I/O
8 (16) 8 × 1 3.7 3.9 128 MiB
16 MiB per CCX
SP3
1P/2P
180 W
EPYC 7F52 US $3100 8 × CCD
1 × I/O
16 (32) 16 × 1 3.5 3.9 256 MiB
16 MiB per CCX
240 W
EPYC 7F72 US $2450 6 × CCD
1 × I/O
24 (48) 12 × 2 3.2 3.7 192 MiB
16 MiB per CCX
240 W
  1. ^ Active Core Complexes (CCX) × Active cores per CCX.
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  70. ^ "AMD Ryzen™ 3 5300U". AMD.
  71. ^ "AMD Ryzen™ 5 5500U". AMD.
  72. ^ "AMD Ryzen™ 7 5700U". AMD.

Video game consolesEdit

GalleryEdit

See alsoEdit

ReferencesEdit