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Power Electronic Devices edit

Silicon Based Devices Description Example
Diode Uni-polar, uncontrolled, switching device used in applications such as rectification and circuit directional current control. Reverse voltage blocking device, commonly modeled as a switch in series with a voltage source, usually 0.7 vdc. The model can be enhanced to include a junction resistance, in order to accurately predict the diode voltage drop across the diode with respect to current flow.
 
Typical diode packages in same alignment as diode symbol. Thin bar depicts the cathode.
Thyristor Thyristor – refers to a family of three terminal devices that include SCRs, GTOs, and MCT. For most of the devices, a gate pulse turns the device on. The device turns off when the reverse voltage at the anode is more negative than the cathode. When off, it is considered a reverse voltage blocking device.
 
Circuit symbol for a thyristor.
SCR This semi-controlled device turns on when a gate pulse is present and the anode is positive compared to the cathode. When a gate pulse is present, the device operates like a standard diode. When the anode is negative compared to the cathode, the device turns off and blocks positive or negative voltages present. The gate voltage does not allow the device to turn off.
 
Circuit symbol for a SCR.
gate turn-off thyristor (GTO) The device, unlike an SCR, can be turned on and off with a gate pulse. One issue with the device is that turn off gate voltages are usually larger and require more current than turn on levels. This turn off voltage is a negative voltage from gate to source, usually it only needs to be present for a short time, but the magnitude s on the order of 1/3 of the anode current. A snubber circuit is required in order to provide a useable switching curve for this device. Without the snubber circuit, the GTO cannot be used for turning inductive loads off. These devices, because of developments in IGCT technology are not very popular in the power electronics realm. They are considered controlled, uni-polar and bi-polar voltage blocking.
 
gate turn-off thyristor symbol.
Triac The triac is a device that is essentially an integrated pair of phase-controlled thyristors connected in inverse-parallel on the same chip.6 Like an SCR, when a voltage pulse is present on the gate terminal, the device turns on. The main difference between an SCR and a Triac is that both the positive and negative cycle can be turned on independently of each other, using a positive or negative gate pulse. Similar to an SCR, once the device is turned on, the device cannot be turned off. This device is considered bi-polar and reverse voltage blocking.
 
Triac schematic symbol.
bipolar (junction) transistor (BJT) Device cannot be used at high power, slower and more on resistive losses when compared to Mosfet type devices. In order to carry high current, BJTs must have relatively large base currents, thus these devices have high power losses when compared to Mosfet devices. BJTs along with Mosfets, are also considered unipolar and do not block reverse voltage very well, unless installed in pairs with protection diodes. Generally, BJTs are not utilized in power electronics switching circuits because of the i^2*r losses associated with on resistance and base current requirements. 1 BJTs have lower current gains in high power packages, thus requiring them to be setup in Darlington configurations in order to handle the currents required by power electronic circuits. Because of these multiple transistor configurations, switching times are in the hundreds of nanoseconds to microseconds. Devices have voltage ratings which max out around 1500 volts and fairly high current ratings. They can also be paralleled in order to increase power handling, but must be limited to around 5 devices for current sharing.
 
The symbol of a PNP BJT. The symbol "points in proudly."
 
The symbol of an NPN BJT. The symbol is "not pointing in."
Power MOSFET The main benefit from Mosfet technology over BJTs, is lower gate current (base current for BJT is large compared to almost zero for Mosfet gate current). Since the Mosfet is a depletion channel device, voltage, not current is necessary to create a conduction path from drain to source. The gate does not contribute to either drain or source current. Turn on gate current is essentially zero with the only power dissipated at the gate coming during switching. Losses in Mosfets are largely attributed to on-resistance. The calculations show a direct correlation to drain source on-resistance and the device blocking voltage rating, BVdss . Depending on manufacturer, a typical drain source resistance is a function of BVdss as follows:

k – depends on device structure BVdss – blocking voltage drain source

Switching times range from tens of nanoseconds to a few hundred microseconds, depending on the device. Mosfet drain source resistances increase as more current flows through the device. As frequencies increase the losses increase as well, making BJTs more attractive. Power Mosfets can be paralleled in order to increase switching current and therefore overall switching power. Nominal voltages for Mosfet switching devices range from a few volts to a little over 1000 volts, with currents up to about 100 amps or so. Newer devices may have higher operational characteristics. Mosfet devices are not bi-directional, nor are they reverse voltage blocking.

 
Cross section of a VDMOS, showing an elementary cell. Note that a cell is very small (some micrometres to some tens of micrometres wide), and that a Power MOSFET is composed of several thousand of them.
Insulated Gate Bi-Polar Transistor (IGBT) These devices have the best characteristics of Mosfets and BJTs. Like Mosfet devices, the IBGT has a high gate impedance, thus low gate current requirements. Like BJTs, this device has low on state voltage drop, thus low power loss across the switch in operating mode. Similar to the GTO, the IGBT can be used to block both positive and negative voltages. Operating currents are fairly high, in excess of 1500 amps and switching voltage up to 3000 volts. 2 The IGBT has reduced input capacitance compared to MOSFET devices which improves the Miller feedback effect during high dv/dt turn on and turn off.
 
Electronic symbol for depletion-mode IGBT.
MOS Controlled Thyristor (MCT) This device is thryistor like and can be triggered on or off by a pulse to the MOSFET gate.6 Since the input is MOS technology, there is very little current flow, allowing for very low power control signals. The device is constructed with two mosfet inputs and a pair of BJT output stages. Input MOSFETs are configured to allow turn on control during positive and negative half cycles. The output BJTs are configured to allow for bidirectional control and low voltage reverse blocking. Some benefits to the MCT are fast switching frequencies, fairrly high voltage and medium current ratings (around 100 amps or so).
 
Circuit symbol for a MOS Controlled Thyristor.
Integrated Gate Commutated Thyristor (IGCT) Similar to a GTO, but without the high current requirements to turn on or off the load. This device can be used for quick switching with little gate current. The devices high input impedance largely because of the mosfet gate drivers. They have low resistance outputs that don't waste power and very fast transient times that rival that of BJTs. ABB has published data sheets for these devices and provided descriptions of the inner workings. The device is comprised of a gate, with an optically isolated input, low on resistance BJT output transistors which lead to a low voltage drop and low power loss across the device at fairly high switching voltage and current levels.

An example of this new device from ABB shows how this device improves on GTO technology for switching high voltage and high current in power electronics applications. According to ABB, the IGCT devices are capable of switching in excess of 5000 ACV and 5000 Amps at very high frequencies, something not possible to do efficiently with GTO devices.

 
Circuit symbol for an IGCT.