File:Wirebonding Workaround.svg

Original file (SVG file, nominally 842 × 450 pixels, file size: 100 KB)

Summary

Description

Cyril BUTTAY

Sketch showing the internal connections of a Power transistor package (D2PAK type). The drain connection is made via the copper pad on the bottom of the silicon die.
Date 30 March 2006 (original upload date)
Source Wirebonding.svg
Author No machine-readable author provided. CyrilB~commonswiki assumed (based on copyright claims).

Licensing

I, the copyright holder of this work, hereby publish it under the following licenses:
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  • attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
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This licensing tag was added to this file as part of the GFDL licensing update.
w:en:Creative Commons
attribution share alike
This file is licensed under the Creative Commons Attribution-Share Alike 2.5 Generic, 2.0 Generic and 1.0 Generic license.
You are free:
  • to share – to copy, distribute and transmit the work
  • to remix – to adapt the work
Under the following conditions:
  • attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
  • share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
You may select the license of your choice.

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30 March 2006

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Date/TimeThumbnailDimensionsUserComment
current18:19, 26 December 2017Thumbnail for version as of 18:19, 26 December 2017842 × 450 (100 KB)JoKalliauer

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