![File:B-ad-schematicbondingprocess.svg](http://upload.wikimedia.org/wikipedia/commons/thumb/6/67/B-ad-schematicbondingprocess.svg/463px-B-ad-schematicbondingprocess.svg.png)
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Date/Time | Thumbnail | Dimensions | User | Comment | |
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current | 11:01, 30 March 2011 | ![]() | 476 × 616 (9 KB) | Enaswiki | {{Information |Description ={{en|1=Schematic SU-8 wafer bond process.}} |Source =M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Author =Fraunhofer ENAS, [[U |
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