Henriok

Greetings

Wikipedia:Babel

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• I live in Sweden, born in 1976.
• I have a special interest in all things PowerPC and Power Architecture.
• Got 379.13 Wikipediholic points - 2006-08-17

Contact

Please e-mail me if you'd like to chat: henriok (at) mac.com

Contributions

Articles

Initiated by me, from scratch

Power Architecture	PowerQUICC	PAPR	Power.org
PowerPC 400	ppc64	P.A. Semi	PWRficient
IBM ViVA	Genesi	EFIKA	PowerPC 600
Interlaken (networking)	PowerPC e200	Lx86	PowerPC 5000
PowerPC e500	James A. Kahle	Airgap	Titan (microprocessor)
Intrinsity	mobileGT	PowerPC e300	PowerPC e600
CoreConnect	SpursEngine	IBM z10 (microprocessor)	IBM System z10
IBM Rivina	Gekko (microprocessor)	QCDOC	PowerPC e700
IBM Power Systems	QorIQ	Fixstars Solutions	IBM Sequoia
Petascale	PERCS	Arek Dreyer	Maciej Stachowiak
Apple A4	Daniel W. Dobberpuhl	PowerPC A2 / PowerEN	PowerPC e5500
IBM zEnterprise System	IBM z196 (microprocessor)	PowerPC e6500	IBM zEC12 (microprocessor)
Apple A6	Espresso (microprocessor)	IBM POWER Instruction Set Architecture	IBM POWER microprocessors
OpenPOWER Foundation	POWER8	Apple A7	PowerPC-based game consoles
DOME (supercomputer)	DOME Microserver	Apple A8	IBM z13 (microprocessor)
POWER9	Coherent Accelerator Processor Interface	IBM z14 (microprocessor)	OpenPOWER Microwatt
Apple A14	Apple T2

Major contributions by me

POWER6	POWER7	PowerPC G4	PowerPC G3
Pegasos	Open Desktop Workstation	PowerPC 970	Xenon (processor)
Template:Power Architecture	Category:Power Architecture	Template:CPU technologies	Terra Soft Solutions
IBM Roadrunner	Top500	POWER1	RS/6000
Apple silicon	Apple M7	Apple S1

Prototypes / Work in progress

User:Henriok/Tables

User:Henriok/POWER9

User:Henriok/Power ISA Table

Images

Created or uploaded by me

• 
  PowerPC 601
• 
  PowerPC 601v
• 
  PowerPC 603 in a ceramic BGA package
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  PowerPC 603 in a wire bond QFP
• 
  PowerPC 604e
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  PowerPC 750 from a PowerMac
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  PowerPC 750CXe in a HPBGA package
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  PowerPC Gekko from a Nintendo GameCube
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  PowerPC 7450
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  PowerPC 7455
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  POWER3s in an RS/6000
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  A PowerPC 855T PowerQUICC processor in a plastic BGA package
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  MPC8245 in a Qlogic SANbox 5200 in TBGA package
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  MPC5200
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  CPU board of an ANS700
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  ExpressCards vs PCCard
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  Bedstraw Hawk moth larva (Hyles gallii), Uppsala, Sweden
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  Screenshot of Yellow Dog Linux, v5.0
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  IBM STB04500. In a "Dilog DT 550", a PowerPC based set top box.
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  A schematic showing the evolution of the different POWER, PowerPC and Power ISAs.
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  A scematic of the TriBlade module in the Roadrunner supercomputer
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  A schematic overview of Roadrunner
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  A schematic overview of Blue Gene/L
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  A schematic overview of Blue Gene/P
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  The chip complex of the RIOS-1 processor
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  The chip complex of the RIOS.9 processor
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  The MCM of a POWER2 processor
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  A generic Power Architecture processor
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  Great Black-backed Gull photographed by Fredrik Dolk in Stockholm.
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  Charles Edge
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  Timo Sirainen
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  A schematic overview of the SpursEngine chip
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  A schematic overview of the QCDOC chip
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  A schematic overview of the RISC Single Chip chip
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  A schematic overview of the POWER3 chip
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  A schematic overview of the POWER4 chip
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  A schematic overview of one POWER4 core
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  An illustrated Apple A4 processor
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  An illustrated Apple A5 processor
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  AMCC PowerPC 440SPe processor
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  An illustrated Apple A5X processor
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  An illustrated Apple A5 R2 processor
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  An illustrated Apple A6 processor
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  An illustrated Apple A6X processor
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  An illustration of the Nintendo Wii U processor, with heat spreader
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  An illustration of the Nintendo Wii U processor MCM, without the heat spreader
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  An illustration of the application processor SoC in Apple's iPod nano 4 and iPod touch 2
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  An illustration of the application processor SoC in Apple's original iPhone, iPhone 3G and original iPod touch
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  An illustration of the application processor SoC in Apple's iPhone 3GS
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  An illustration of the application processor SoC in Apple's iPod touch 3
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  An illustration of the XCPU-ES in Microsoft's Xbox 360
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  An illustration of the XCPU "Zephyr" in Microsoft's Xbox 360
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  An illustration of the XCPU "Falcon" in Microsoft's Xbox 360
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  An illustration of the XCGPU in Microsoft's Xbox 360S
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  An illustration of the XCGPU in Microsoft's Xbox 360S with heatspreader
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  An illustration of Toshiba's SpursEngine accelerator chip
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  An illustration of IBM's PowerPC 970 processor
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  An illustration of IBM's PowerPC970FX processor
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  An illustration of IBM's PowerPC 970MP dual core processor
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  An illustration of IBM's defunct PowerPC 970GX processor
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  An illustrated Apple A5 R3 processor
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  An illustration of Motorola's PowerPC 750 processor
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  An illustration of Motorola's PowerPC 740 processor
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  An illustration of Motorola's PowerPC 755 processor
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  An illustration of IBM's PowerPC 750L processor
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  An illustration of IBM's PowerPC 740L processor
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  An illustration of IBM's PowerPC 750CX processor
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  An illustration of IBM's PowerPC 750CXe processor
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  An illustration of IBM's Gekko processor
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  An illustration of IBM's PowerPC 750FX processor
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  An illustration of IBM's PowerPC 750GX processor
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  An illustration of IBM's PowerPC 750CL processor
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  An illustration of IBM's Broadway A processor
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  An illustrated Apple A7 processor
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  An illustrated Apple M7 co-processor
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  The size difference between the M7 and A7 according to Apple
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  The LPC18A1, aka "Apple M7"
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  The size difference between the LPC18A1 and A7
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  The RAD750 radiation hardened processor
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  An illustration of IBM's POWER3 processor
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  An illustration of IBM's POWER3-II processor
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  An illustration of IBM's POWER4 processor on a single chip module
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  An illustration of IBM's POWER4 processor on a dual chip module
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  An illustration of IBM's POWER4 processor on a multi chip module
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  An illustration of IBM's POWER5 processor on a dual chip module
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  An illustration of IBM's POWER5 processor on a multi chip module
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  An illustration of IBM's POWER5+ processor on a dual chip module
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  An illustration of IBM's POWER5+ processor on a quad chip module
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  An illustration of IBM's POWER6 processor on a ceramic substrate
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  An illustration of IBM's POWER6 processor on an organic substrate
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  An illustration of IBM's POWER6 processor on a dual chip module
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  An illustration of IBM's POWER6 processor on a multi chip module
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  An illustration of IBM's POWER7 processor on a ceramic substrate
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  An illustration of IBM's POWER7 processor on an organic substrate
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  An illustration of IBM's POWER7 processor on a multi chip module
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  An illustration of BAE's RAD6000 radiation hardened space processor
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  The 90 nm CellBroadband Engine, the CPU of the PlayStation 3.
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  The Cell/B.E. with its lid on.
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  The underside of the 90 nm Cell/B.E.
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  The 65 nm version of Cell/B.E.
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  The 45 nm version of Cell/B.E.
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  The 65 nm high performance PowerXCell 8i.
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  An illustration of IBM's P2SC+ processor.
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  An illustration of IBM's POWER1 RSC processor.
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  An illustration of IBM's POWER2 processor.
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  An illustration of IBM's POWER2+ processor.
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  An illustration of IBM's POWER8 DCM processor.
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  An illustration of the Apple A8 system-on-a-chip.
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  An illustration of the Apple S1 integrated computer (defunct)
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  An illustration of the Apple S1 integrated computer
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  An illustration of the Apple S1 integrated computer, chips showing.
• 
  This is how large the S1 is compared to the Apple Watch.
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  The LPC18B1, aka "Apple M8"
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  The size difference between the LPC18B1 and A8
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  An illustration of the Apple A8X system-on-a-chip.
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  An illustration of Motorola's MPC7400 processor.
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  An illustration of Motorola's MPC7410 processor.
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  An illustration of Freescale's MPC7410 processor.
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  An illustration of Motorola's MPC7450 processor.
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  An illustration of Motorola's MPC7440 processor.
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  An illustration of Motorola's MPC7455 processor.
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  An illustration of Motorola's MPC7445 processor.
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  An illustration of Motorola's MPC7457 processor.
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  An illustration of Freescale's MPC7447/A processor.
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  An illustration of Freescale's MPC7448 processor.
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  An illustration of Freescale's MPC8641D processor.
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  An illustration of Freescale's MPC8610 processor.
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  An illustration of Freescale's MPC8640D processor.
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  An illustration of the MPC7400 manufactured by IBM on Apple's request.
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  An illustration of IBM's Broadway-1 processor.
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  An illustration of IBM's Broadway-1 processor, without heat spreader.
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  An illustration of IBM's Broadway B processor.
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  An illustration of IBM's Broadway B processor, without heat spreader.
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  An illustration of IBM's Broadway processor.
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  An illustration of IBM's Broadway processor, without heatspreader.
• 
  An illustration of Samsung's Apple A9 system-on-a-chip.
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  An illustration of TSMC's Apple A9 system-on-a-chip.
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  An illustration of TSMC's Apple A9X system-on-a-chip.
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  An illustration of TSMC's Apple A10 Fusion system-on-a-chip.
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  An illustration of the Apple S2 integrated computer.
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  An illustration of the Apple S1P integrated computer.
• 
  This is how large the S2 is compared to the Apple Watch.

And these (logos must not be shown in user pages)

Yellow Dog Linux logo	PWRficient logo	Power Architecture logo	Genesi logo	Saab Automobile logo
	Fixstars Solutions logo