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Original file (3,723 × 2,896 pixels, file size: 4.24 MB, MIME type: image/jpeg)
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Summary
| Description |
English: Near-infrared photograph of a delidded AMD Epyc 7702 engineering sample. The chip in the middle is the IO die – manufactured on 12 nanometer by GlobalFoundries – and the eight smaller chips on either side are Core Complex Dies, manufactured on 7 nanometer by TSMC. |
| Date | |
| Source | https://www.flickr.com/photos/130561288@N04/48938258367/ |
| Author | Fritzchens Fritz |
Licensing
 
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This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication. |
| The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission.
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This image was originally posted to Flickr by FritzchensFritz at https://flickr.com/photos/130561288@N04/48938258367 (archive). It was reviewed on 30 November 2019 by FlickreviewR 2 and was confirmed to be licensed under the terms of the cc-zero. |
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 01:06, 30 November 2019 | | 3,723 × 2,896 (4.24 MB) | Veikk0.ma | User created page with UploadWizard |
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